Gold-Plated Miniature Liquid Cooling Plate

I. Core Features (Matching your requirements: strong heat dissipation, no leakage, long service life)

1. Strong Heat Dissipation (Ultra-low Resistance, Micro-channels)

• Base material: mostly oxygen-free high-conductivity copper (OFHC Cu) or molybdenum-copper (MoCu), with thermal conductivity of 380~401 W/m·K.
• Flow channels: micro-channels, pin fins, or etched channels (50~200μm in width), with thermal resistance as low as 0.01~0.05℃·cm²/W.
• Gold-plated interface: gold (~317 W/m·K) is non-oxidizing with extremely low contact thermal resistance, superior to nickel or tin coatings.
• Ultra-thin profile: thickness 1~5mm, providing an extremely short heat transfer path from heat source to coolant.

2. No Leakage (Miniature High-Reliability Sealing)

• Processes: vacuum brazing, diffusion bonding, laser welding (adhesives and sealing rings free).
• Pressure resistance: 3~10 bar, helium leak rate ≤1×10⁻⁸ Pa·m³/s.
• Small size: 20×20mm ~ 80×80mm, suitable for chips, lasers, and RF devices.

3. Long Service Life (Corrosion Resistance, Anti-aging, High Durability)

• Gold plating thickness: 0.1~2μm (commonly 0.5~1μm).
• Chemical inertness: water resistant, salt spray resistant, non-oxidizing, free from galvanic corrosion.
• Diffusion barrier: typically a 3~5μm nickel underlayer to prevent copper migration.
• Temperature range: -55℃~150℃, stable under thermal cycling.
• Service life: meets military / aerospace / optical module standards (10~20 years).

II. Real Functions of Gold Plating (Not for Decoration)

• Reduce interface thermal resistance: direct contact with chips / heat sinks, no oxide layer, stable thermal resistance.
• Anti-corrosion: no rust, scaling, or electrical leakage in coolant or air environments.
• Solderable & bondable: compatible with soldering, AuSn soldering, and ultrasonic bonding (semiconductor / optical communications).
• Anti-galvanic corrosion: stable potential between copper and gold in liquid cooling systems, avoiding electrochemical corrosion.
• High reliability: zero-failure requirements for military, aerospace, and medical applications.

III. Main Structures and Processes

Micro-channel Etched Type (Most Common)

Tube-embedded Miniature Type

Gold-Plated MoCu / WCu Type

IV. Typical Application Scenarios

• Optical communications: TOSA/ROSA, EDFA, high-speed optical modules, laser diodes.
• Semiconductors: high-end CPU/GPU/ASIC, SiC/GaN power chips, probe stations.
• Military / Aerospace: missile-borne computers, radar T/R components, satellite electronics.
• Medical treatment: precision instruments, laser therapy, superconducting / cryogenic probes.
• High-end industrial control: high-precision servos, LiDAR, quantum computing chips.

V. Key Parameters (Industry Standard)

• Dimensions: 20×20 ~ 80×80mm, thickness 1~5mm.
• Materials: OFHC copper (C1100/C1020), molybdenum-copper (MoCu).
• Plating: Ni 3~5μm + Au 0.5~1μm (hard gold / soft gold).
• Flow resistance: 0.5~2 bar @ 0.5~2 L/min.
• Thermal resistance: 0.02~0.08℃·cm²/W (@25℃ water).
• Working pressure: ≥6 bar, bursting pressure ≥12 bar.
• Leak detection: helium leak rate ≤1×10⁻⁸ Pa·m³/s.

VI. One-Sentence Summary